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Tom's HardwareSilicon

TSMC reportedly weighs 20% CoWoS price increase as Nvidia Blackwell and Rubin chips put pressure on packaging capacity

10.27

TSMC is weighing raising prices for its Chip on Wafer on Substrate (CoWoS) advanced packaging technology by as much as 20%, reports Trendforce , citing supply chain sources and local media.

Chips & compute
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