EE Times

8 stories

EE TimesSiliconIs There Room for Small-Scale OSATs in India’s Chip Packaging Boom? India’s expanding outsourced semiconductor assembly and test (OSAT) industry is creating opportunities for smaller, specialized packaging facilities alongside large, capital-intensive plants.…

11.03

EE TimesSiliconAccepting Orders for the LED Light-Sourced Projection Aligners The UX-4 series is a full-field projection aligner that has a proven track record over many years as lithography equipment that enhances production efficiency, primarily for power semiconductors…

11.03

EE TimesSiliconBringing Design Data Management into the Developer Workflow As digital design workflows increasingly center on modern, text-based development environments, engineers expect the same efficiency from design data management as they do from coding tools.

11.03

EE TimesSiliconAI Hardware’s Hidden Cost: Between Orders and Output Alphabet’s inventory rose from $2.4 billion at the end of 2025 to $13.3 billion in September 2026, reflecting in part Google’s expanding role as an AI hardware supplier.

11.03

EE TimesSiliconFive Things You Didn’t Know About Co-Packaged Optics Why advanced packaging will determine whether CPO can scale for the AI era Co-packaged optics technology is often described as a photonics breakthrough.

11.03

EE TimesSiliconMarvell Snaps Photonics Chipmaker Lumentum to Bolster AI Connectivity The AI networking specialist Nvidia’s Jensen Huang calls the next trillion-dollar company has made a long-anticipated move into photonics by acquiring optical component maker Lumentum in an all-stock…

11.03

EE TimesSiliconMacronix Builds Hardware Security into NOR Flash Ahead of EU Cyber Resilience Act The European Union’s Cyber Resilience Act (CRA), which becomes mandatory in December 2027, is raising the bar for cybersecurity in connected devices. Rather than relying on software patches to…

11.03

EE TimesSiliconCanada’s Quantum Sector Sets Sights on Commercialization Canada’s quantum sector has already demonstrated that it can produce world-class research, but the big question in 2026 is whether it can commercialize that research and translate it into…

11.02

The name is the button.

An agent writes the code now, and a human thumb hovers over Accept all a hundred times a day. The honest question of this decade is what, exactly, you just accepted. So I read the diff.

Eight years as a backend engineer in Stockholm, back in Tokyo since 2023, and I still ship something small most nights, usually badly. My one rule: the only real review of a model is the thing you built with it. That is why there is no leaderboard on this site.

Around a hundred and forty sources come through — the labs' own posts, the papers, the tools, the runtimes and languages nobody is watching yet, the chip under the demo, and the newsletters people actually forward. What is moving gets counted so the week reads at a glance, and every few days I explain one mechanism in plain words.

A story here is a headline, a short excerpt, one image and the link to whoever wrote it. We never reproduce the post; the images belong to their authors. A post written in Japanese appears in Japanese, exactly as it was published, and the link goes to the original.

— Yuki Halvorsen, Tokyo