EE Times
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EE TimesSiliconEE Times Magazine – September 2026 The September 2026 edition of EE Times Magazine examines how smarter buildings combine ambient energy harvesting, sensing, AI, and connected systems to improve safety while protecting privacy.

EE TimesSiliconWhen the Package Becomes an Electrical Design Variable AI power integrity now lives inside the package, not just the PCB. Treat chip, package, and board as one PDN.

EE TimesSiliconTechWorks Aligns U.K. Semiconductors Under UKSIA Umbrella TechWorks corrals U.K. chip groups under UKSIA as funding surges 65% and 700 execs swarm London.

EE TimesSiliconIndia’s Quantum Journey Goes Beyond the Qubit IBM’s Amaravati deployment could accelerate India’s quantum ecosystem as startups develop processors, software, and supporting technologies.

EE TimesSiliconMercedes Spinout Athos Closes Its Doors The startup was unable to secure the financing required to continue commercialising its chiplet-based technology
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